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Focusing on power electronic packaging, the book provides a comprehensive exploration of design, assembly, reliability, and failure analysis. It emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for understanding the complexities and innovations in this specialized field.
Buchkauf
Power Electronic Packaging, Yong Liu
- Sprache
- Erscheinungsdatum
- 2014
- product-detail.submit-box.info.binding
- (Paperback)
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- Titel
- Power Electronic Packaging
- Untertitel
- Design, Assembly Process, Reliability and Modeling
- Sprache
- Englisch
- Autor*innen
- Yong Liu
- Verlag
- Springer New York
- Erscheinungsdatum
- 2014
- Einband
- Paperback
- Seitenzahl
- 612
- ISBN13
- 9781489987976
- Kategorie
- Elektrotechnik, Naturwissenschaften
- Beschreibung
- Focusing on power electronic packaging, the book provides a comprehensive exploration of design, assembly, reliability, and failure analysis. It emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for understanding the complexities and innovations in this specialized field.